OverviewWLCSP is one of the key technologies for high - density packaging. Along with technologies like Chiplet and SiP, it is regarded as a core technology to extend Moore's Law. Its core advantages lie in miniaturization, high performance, and low cost.
Application
Product List
| Product Name | Product status | Package | Technology | Configuration | Vss Max (V) |
Is Max (A) |
VGS(th) Typ (V) |
VGS Max (V) |
RSS(ON) Typ (mΩ) | Package Size | ESD | MPQ (pcs) |
MOQ (pcs) |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10V | 8V | 4.5V | 3.8V | 3.1V | 2.5V | 1.8V | 1.5V | X (mm) |
Y (mm) |
T (um) |
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